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June 2012

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Subject:
bond strength spec of foil-to-dielectric
From:
Charming Chan <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Charming Chan <[log in to unmask]>
Date:
Wed, 13 Jun 2012 20:08:36 -0400
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Hi TechNet,

IPC spec has peel strength and test methods specified, but no spec on bond strength of foil-to-dielectric under shear force or pull force.

We have a SMT connector mounted on a midplane pwb, and need to evaluate if peel off or pad cratering under mechanical shock.

Any inputs on the bond strength of SMD pad under shear force parallel to pwb surface and pull force perpendicular to pwb surface? Thanks.


Charming Chan

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