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June 2012

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Subject:
From:
Chris Mahanna <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Chris Mahanna <[log in to unmask]>
Date:
Fri, 1 Jun 2012 17:54:49 -0400
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Agreed.  The appropriate techniques to get to the answer quickly vary by finish, and sometimes what feature is giving you trouble.

However, 003 durability of coating rating 3 preconditioning should be your first choice regardless.

HASL and IAg you're looking for Cu oxidation
ENIG you're looking for Ni corrosion

Chris

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Louis Hart
Sent: 2012/06/01 3:10 PM
To: [log in to unmask]
Subject: [TN] pad surface analysis

TechNetters,  surface solderability of a batch of boards has been questioned by a customer. J-STD-003 solderability testing before the boards were shipped, and again, on spare coupons, after receipt by the customer was unremarkable, i.e., everything passed.

In that context, I am wondering what analytical tools are suitable for analyzing a surface for possible contaminants or residue, in particular those which might inhibit soldering. Some searches of the archives since 28 Feb 2012 turned up no postings relating solderability and surface analysis.

Thanks for any information or comments.

Louis Hart
Compunetics
Monroeville, PA
USA
[log in to unmask]<mailto:[log in to unmask]>
412-858-1232


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