Louis,

What is the surface finish on the boards?

Regards,
George
George M. Wenger
Senior Principal Reliability / FMA Engineer
Andrew Corporation - Wireless Network Solutions
40 Technology Drive, Warren, NJ 07059
(908) 546-4531 Office (732) 309-8964 Mobile
E-mail: [log in to unmask]

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Louis Hart
Sent: Friday, June 01, 2012 3:10 PM
To: [log in to unmask]
Subject: [TN] pad surface analysis

TechNetters,  surface solderability of a batch of boards has been questioned by a customer. J-STD-003 solderability testing before the boards were shipped, and again, on spare coupons, after receipt by the customer was unremarkable, i.e., everything passed.

In that context, I am wondering what analytical tools are suitable for analyzing a surface for possible contaminants or residue, in particular those which might inhibit soldering. Some searches of the archives since 28 Feb 2012 turned up no postings relating solderability and surface analysis.

Thanks for any information or comments.

Louis Hart
Compunetics
Monroeville, PA
USA
[log in to unmask]<mailto:[log in to unmask]>
412-858-1232


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