Jedec 22-B117A

Joyce Koo
Materials Researcher - Materials Interconnect Lab
Research In Motion Limited
Office: (519) 888-7465 79945
Mobile: (226) 220-4760


-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Phil Bavaro
Sent: Thursday, June 07, 2012 12:29 PM
To: [log in to unmask]
Subject: Re: [TN] Cold Ball Pull, solder bump

Victor,

Not sure what you mean by this.....are you talking BGA ball, BCC bumps
or maybe solder ball shear test?

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Victor Hernandez
Sent: Thursday, June 07, 2012 9:04 AM
To: [log in to unmask]
Subject: [TN] Cold Ball Pull, solder bump

Fellow TechNetters:

   Has anyone out there have experience with this method that they want
to share?   Is there an IPC or other industry document out there?   Any
recommend tools/equipment for this test?

Victor,

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