Hi Richard,
My understanding is that ENIG process provides a thin Gold coating to the
traces to provide uniformity and better high-frequency response. Which is
why PCBs designed for multi-Gigahertz operation use this process.
Regards
Ravinder Ajmani
HGST, a Western Digital company
[log in to unmask]
5601 Great Oaks Pkwy.
San Jose, CA 95119-1003
www.hgst.com
"Stadem, Richard D." <[log in to unmask]>
Sent by: TechNet <[log in to unmask]>
06/27/2012 10:24 AM
Please respond to
TechNet E-Mail Forum <[log in to unmask]>; Please respond to
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Re: [TN] High frequency, ENIG and no-clean
Sorry about that, "send" button was hit before I finished.
Ioan's original question was:
Can anybody point me towards papers talking about the influence of
no-clean soldering and ENIG on high frequency performance?
- With ENIG, your final surface layer is nickel, not gold.
- For very high frequency signals (generally considered to be above 1
gigahertz), electrical conductance takes place on the surface of the trace
(the nickel-plated part) due to the Hall or "skin" effect.
- Nickel's conductivity at frequencies above 1 Ghz is somewhat reduced,
compared with copper or gold. This is considered a "lossy" circuit
performance. There are many papers on this subject, including some from
Werner Engelmaier.
- I did not address losses through flux residues, only those regarding
signal loss in Db through nickel. But again, signal crosstalk and loss
through flux residue is well-documented.
I can assure you, Bob, it is NOT "hogwash".
-----Original Message-----
From: Stadem, Richard D.
Sent: Wednesday, June 27, 2012 12:10 PM
To: [log in to unmask]
Subject: RE: [TN] High frequency, ENIG and no-clean
Go back to Ioan's original question:
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Robert Kondner
Sent: Wednesday, June 27, 2012 11:46 AM
To: [log in to unmask]
Subject: Re: [TN] High frequency, ENIG and no-clean
Hi,
I have often wondered if this No-Clean Flux vs. RF issue was real or hog
wash so I tried to look at these links.
The first link must have changed pages, can anyone identify the new link
or subject description.
The second link was about the Ni plating vs. RF. I saw no reference to
flux or no clean. Did I miss something in my quick scan?
Thanks,
Bob K.
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Stadem, Richard D.
Sent: Wednesday, June 27, 2012 11:31 AM
To: [log in to unmask]
Subject: Re: [TN] High frequency, ENIG and no-clean
http://www.taconic-add.com/mwg-internal/de5fs23hu73ds/progress?id=rG3E1oaXW1
http://athena-gatech.org/papers/staiculescu13.pdf
There are many more.
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Ioan Tempea
Sent: Wednesday, June 27, 2012 9:00 AM
To: [log in to unmask]
Subject: [TN] High frequency, ENIG and no-clean
Dear Technos,
Can anybody point me towards papers talking about the influence of
no-clean soldering and ENIG on high frequency performance?
Thanks,
Ioan Tempea
Ingénieur principal de fabrication / Senior Manufacturing Engineer
<http://www.digico.cc/>
950 RUE BERGAR, LAVAL, QC, H7L 5A1 <http://g.co/maps/2gh3f>
T+ 1 (450) 967-7100, EXT244
------------------------------------------------------------------------
<http://www.facebook.com/pages/Digico/277076778479>
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Lauréat Dunamis 2012 <http://digico.cc/dunamis-2012/>
Entreprise manufacturière / Gestion du capital humain
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