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June 2012

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From:
"Stadem, Richard D." <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Stadem, Richard D.
Date:
Mon, 4 Jun 2012 07:42:33 -0500
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Hi-RF circuits (greater than 1 gigahertz) are much more susceptible to crosstalk issues, ie, the lower circuit impedance paths provided by the no-clean flux residues provide alternate signal paths, especially over time.

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Bev Christian
Sent: Friday, June 01, 2012 7:32 PM
To: [log in to unmask]
Subject: Re: [TN] Cleaning PCB Assemblies

Bill,
I'm just a generalist, not a cleaning expert or a component guru.  First, a point of clarification, by roll solder do you mean wire solder? Second, why did they voice concern? I mean if you are using no-cleans then why in the world are you cleaning at all?  If you HAVE to clean, then why not use amore active fluxes that are meant to be cleaned? And finally what is the concern about RF parts?
Bev

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of [log in to unmask]
Sent: Friday, June 01, 2012 7:49 PM
To: [log in to unmask]
Subject: [TN] Cleaning PCB Assemblies

Hi Folks!!  Could use some help.  We are a contract mfg. using no-clean solder paste and roll solder for secondary ops and touch-up.  Some of the PCB assemblies contain RF components and we have had a customer voice some concerns regarding our cleaning (using EnSolv).
Have heard that new
chemistries with a aqueous washing system have been successful.  Have also heard a vapor degreaser works well but not the greatest choice with RF components.

Would appreciate being pointed in the right direction.

Thanks in advance for your help!!!!!

Regards,
Bill

 
 

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