TECHNET Archives

June 2012

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Condense Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Sender:
X-To:
TechNet E-Mail Forum <[log in to unmask]>, JF <[log in to unmask]>
Date:
Tue, 5 Jun 2012 20:07:10 +0000
Reply-To:
TechNet E-Mail Forum <[log in to unmask]>, "Whittaker, Dewey (EHCOE)" <[log in to unmask]>
Message-ID:
Subject:
From:
"Whittaker, Dewey (EHCOE)" <[log in to unmask]>
MIME-Version:
1.0
In-Reply-To:
Content-Transfer-Encoding:
quoted-printable
Content-Type:
text/plain; charset="us-ascii"
Parts/Attachments:
text/plain (33 lines)
Don't cut corners on the packaging procedures and you won't sulfur the consequences.
Dewey

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of JF
Sent: Tuesday, June 05, 2012 12:48 PM
To: [log in to unmask]
Subject: [TN] Electronic assemblies packaging

Hi all,

Back on Technet after a much needed change of life.

I remember reading, somewhere, that it is not advised to ship electronic 
assemblies in regular cardboard. We are talking electronic boards in an 
enclosure, not an unprotected PCB.

Can anyone give me precisions on this matter?

Thanks!

JF

______________________________________________________________________
This email has been scanned by the Symantec Email Security.cloud service.
For more information please contact helpdesk at x2960 or [log in to unmask] 
______________________________________________________________________

______________________________________________________________________
This email has been scanned by the Symantec Email Security.cloud service.
For more information please contact helpdesk at x2960 or [log in to unmask] 
______________________________________________________________________

ATOM RSS1 RSS2