TECHNET Archives

May 2012

TechNet@IPC.ORG
Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
Re: PCB Lead Free with Tin Lead Process
From:
"Vladimir Igoshev. PhD" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Vladimir Igoshev. PhD
Date:
Fri, 18 May 2012 15:42:32 -0400
Content-Type:
text/plain
Parts/Attachments:
text/plain (23 lines) 
Hello Juliano,

For that specific scenario, the board finish won't mean much in terms
of your regular leaded process.

-- 
Best regards,

Vladimir Igoshev. PhD                          mailto:[log in to unmask]

SENTEC Testing Laboratory Inc.
11 Canadian Road, Unit 7.
Scarborough, ON M1R 5G1
Tel: (416) 899-1882
Fax: (905) 882-8812
www.sentec.ca


______________________________________________________________________
This email has been scanned by the Symantec Email Security.cloud service.
For more information please contact helpdesk at x2960 or [log in to unmask] 
______________________________________________________________________

ATOM RSS1 RSS2