Let me state the obvious even though I did not see it mentioned.....it
is possible to double side hand solder and trap large voids in the
barrel.....I know because I have seen an engineer attempt this.  In his
mind, the solder joints looked great and visually it was
compliant.....but I advised him that the procedure was not authorized
and proceeded to xray the connection and show him the error in his ways.

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Whittaker, Dewey
(EHCOE)
Sent: Wednesday, May 16, 2012 10:45 AM
To: [log in to unmask]
Subject: Re: [TN] Through hole barrel voids

To reject, or not to reject, that is the question:
Whether 'tis Nobler in the mind to suffer The Slings and Arrows of
unfortunate outgassing, Or to take X-rays against a Sea of voids, And by
opposing accept them: to die, to pry No more; and say we end the
heart-ache, and the thousand thermal shocks That the assembly is heir
to? 'Tis a consummation Devoutly to be wished for those who don't have a
bodkin against their chest to honor the bottom line.

Barring the chance that I have missed the connection and this was a
metaphorical response to voids or unfulfilled expectations in life and
not the printed board assembly: all other things being equal; I would
accept them (the PTH voids) as-is.

Dewey    

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Eva J
Sent: Wednesday, May 16, 2012 9:37 AM
To: [log in to unmask]
Subject: Re: [TN] Through hole barrel voids

Craig,
Was this PCB/ connector subjected to wave solder, hand solder and or
intrusive pin/paste solder process?
I have seen touch up soldering to " fill the barrel" on the component
side create voids and contaminant entrapment which may be a reliability
issue.
What is the cumulative fill? Solder fill provides the mechanical
strength to withstand its service environment.
Eva
Spec Tech
On Wed, May 16, 2012 at 9:12 AM, David D. Hillman <
[log in to unmask]> wrote:

> Hi Craig! One of the downsides of now having access to Xray inspection

> technology is that we can see many "things" we never could before - 
> which now causes the question "is that bad?". There is currently no 
> plated thru hole void criteria in the IPC JSTD 001 specification. I 
> would recommend that an assessment of  the assembly be initiated. 
> Pulling and inspecting a number of assemblies that either have been in

> the field or have passed all of the qualification tests will 
> demonstrate what level of voids typically exist and if that level of 
> voiding is a reliability issue. The presence of voids is not
necessarily an indication of a reliability issue. Good Luck.
>
> Dave Hillman
> Rockwell Collins
> [log in to unmask]
>
>
>
> Craig Sullivan <[log in to unmask]>
> Sent by: TechNet <[log in to unmask]>
> 05/16/2012 07:14 AM
> Please respond to
> TechNet E-Mail Forum <[log in to unmask]>; Please respond to Craig 
> Sullivan  <[log in to unmask]>
>
>
> To
> <[log in to unmask]>
> cc
>
> Subject
> [TN] Through hole barrel voids
>
>
>
>
>
>
> Hi everyone,
>
>
>
> We have a certain board with several through hole connectors. The 
> customer has provided us x ray images showing voiding in the barrels. 
> Fillets on both sides are acceptable, and the solderability tests are 
> ok. This seems to be isolated to this board because random sampling on

> other boards shows virtually no voiding. The only voiding "criteria" I

> can find is related to BGAs. Is there any published criteria / 
> reference material for this type of defect?
>
>
>
> Thank you,
>
> Craig Sullivan
>
> Manufacturing Engineer
>
> MPL Incorporated
>
> P: 607.266.0480
>
> F: 607.266.0482
>
>  <mailto:[log in to unmask]> [log in to unmask]
>
> P Please consider the environment before printing this e-mail.
>
>
>
>
>
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