To reject, or not to reject, that is the question:
Whether 'tis Nobler in the mind to suffer
The Slings and Arrows of unfortunate outgassing,
Or to take X-rays against a Sea of voids,
And by opposing accept them: to die, to pry
No more; and say we end the heart-ache, and the thousand thermal shocks
That the assembly is heir to? 'Tis a consummation
Devoutly to be wished for those who don't have a bodkin against their chest to honor the bottom line.

Barring the chance that I have missed the connection and this was a metaphorical response to voids or unfulfilled expectations in life and not the printed board assembly: all other things being equal; I would accept them (the PTH voids) as-is.

Dewey    

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Eva J
Sent: Wednesday, May 16, 2012 9:37 AM
To: [log in to unmask]
Subject: Re: [TN] Through hole barrel voids

Craig,
Was this PCB/ connector subjected to wave solder, hand solder and or
intrusive pin/paste solder process?
I have seen touch up soldering to " fill the barrel" on the component side
create voids and contaminant entrapment which may be a reliability issue.
What is the cumulative fill? Solder fill provides the mechanical strength
to withstand its service environment.
Eva
Spec Tech
On Wed, May 16, 2012 at 9:12 AM, David D. Hillman <
[log in to unmask]> wrote:

> Hi Craig! One of the downsides of now having access to Xray inspection
> technology is that we can see many "things" we never could before - which
> now causes the question "is that bad?". There is currently no plated thru
> hole void criteria in the IPC JSTD 001 specification. I would recommend
> that an assessment of  the assembly be initiated. Pulling and inspecting a
> number of assemblies that either have been in the field or have passed all
> of the qualification tests will demonstrate what level of voids typically
> exist and if that level of voiding is a reliability issue. The presence of
> voids is not necessarily an indication of a reliability issue. Good Luck.
>
> Dave Hillman
> Rockwell Collins
> [log in to unmask]
>
>
>
> Craig Sullivan <[log in to unmask]>
> Sent by: TechNet <[log in to unmask]>
> 05/16/2012 07:14 AM
> Please respond to
> TechNet E-Mail Forum <[log in to unmask]>; Please respond to
> Craig Sullivan  <[log in to unmask]>
>
>
> To
> <[log in to unmask]>
> cc
>
> Subject
> [TN] Through hole barrel voids
>
>
>
>
>
>
> Hi everyone,
>
>
>
> We have a certain board with several through hole connectors. The customer
> has provided us x ray images showing voiding in the barrels. Fillets on
> both
> sides are acceptable, and the solderability tests are ok. This seems to be
> isolated to this board because random sampling on other boards shows
> virtually no voiding. The only voiding "criteria" I can find is related to
> BGAs. Is there any published criteria / reference material for this type
> of
> defect?
>
>
>
> Thank you,
>
> Craig Sullivan
>
> Manufacturing Engineer
>
> MPL Incorporated
>
> P: 607.266.0480
>
> F: 607.266.0482
>
>  <mailto:[log in to unmask]> [log in to unmask]
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> P Please consider the environment before printing this e-mail.
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