I've seen 7.5.5.1 but am not so sure it applies in this case. The sections are being performed by the customer, but based on the xray (I'll see about posting pictures - ITAR and all) I would expect it to show 100% vertical fill with voids throughout the barrel.

Craig Sullivan
Manufacturing Engineer
MPL Incorporated
P: 607.266.0480
F: 607.266.0482
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-----Original Message-----
From: [log in to unmask] [mailto:[log in to unmask]] 
Sent: Wednesday, May 16, 2012 8:42 AM
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Subject: RE: [TN] Through hole barrel voids

Craig,

   IPC-A-610D section 7.5.5.1
What does the cross section of the PTH look like?

Victor,

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Craig Sullivan
Sent: Wednesday, May 16, 2012 7:15 AM
To: [log in to unmask]
Subject: [TN] Through hole barrel voids

Hi everyone, 

 

We have a certain board with several through hole connectors. The customer has provided us x ray images showing voiding in the barrels. Fillets on both sides are acceptable, and the solderability tests are ok. This seems to be isolated to this board because random sampling on other boards shows virtually no voiding. The only voiding "criteria" I can find is related to BGAs. Is there any published criteria / reference material for this type of defect? 

 

Thank you,

Craig Sullivan

Manufacturing Engineer

MPL Incorporated

P: 607.266.0480

F: 607.266.0482

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