Hi everyone, 

 

We have a certain board with several through hole connectors. The customer
has provided us x ray images showing voiding in the barrels. Fillets on both
sides are acceptable, and the solderability tests are ok. This seems to be
isolated to this board because random sampling on other boards shows
virtually no voiding. The only voiding "criteria" I can find is related to
BGAs. Is there any published criteria / reference material for this type of
defect? 

 

Thank you,

Craig Sullivan

Manufacturing Engineer

MPL Incorporated

P: 607.266.0480

F: 607.266.0482

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