TechNetters,

I would like to sense the IPC TechNet forum on the actual use of the ECA/IPC/JEDEC J-STD-075 standard in the industry.
This very well intentioned joint standard entitled "Classification of non-IC Electronic Components for Assembly Processes" targets to classify and label non-semiconductor components with respect to their sensitivity to assembly processes.
Following the standard, sensitive components are supposed to be labeled with a PSL (Process Sensitivity Level) similarly to the MSL of plastic ICs. Process sensitivity includes reflow temperature but also cleaning processes.
Facing regularly failure cases of "sensitive" components, I found this standard very useful and see it as a good curative remedy against these problems but I do not know of any component manufacturers using it.
Would someone use it or saw components following this standard?
Thank you.

Arnaud Grivon
PCB/PCBA Technology Expert
Thales Global Services - ESS (Engineering Shared Services)
18, avenue du Maréchal Juin
Bât. C - Bureau C2-135
92366 Meudon-la-Forêt Cedex
France
Tél : (+33) (0)1 70 28 23 88


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