Q1: Dough, I disagree, but it depends.....in a small scale line
contamination buildup may be no problems, but in a high speed, mass
production going on 24hs a day, buildup can be an issue...again...it
depends on how responsible the operators are to frequent tip exchange. I
have a report that will tell you a lot. Will send offlime....hmmm...offline
Obstinate greetings
Inge
PS. Had to do with five Panasonic lines assembling cell phones for
Ericsson.

On 10 May 2012 18:17, Douglas Pauls <[log in to unmask]> wrote:

> Good morning all,
>
> I am working on a draft of IPC-5703, titled " Cleanliness for
> Fabricators", a kind of Cleanliness 101 for board fab houses.  It should
> be ready for wider review in a month or so, but you can see drafts of it
> here.
>
> http://www.ipc.org/CommitteeDetail.aspx?Committee=5-32C
>
> So you will see several questions from me.
>
> Question 1:  In the board fabrication process (not the OEM/EMS assembly
> process), have any of you ever seen residue accumulation on in-circuit
> test pins or flying probe test pins which interfere with in-circuit test
> continuity?  Our board shop says it does not happen today.  It was a more
> common occurrence 10 years ago when HASL was more prevalent, but I don't
> believe it happens today.
>
> Agree or not, and why.
>
> Thanks.
>
> Doug Pauls
>
>
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