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May 2012

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Subject:
From:
Jerry Dengler <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Jerry Dengler <[log in to unmask]>
Date:
Thu, 10 May 2012 12:30:05 -0400
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Hi Doug,

I work for an EMS company so I do not have any experience with this but
offer the following thought.
  
HASL is still used so if it was a cause before it is still a potential
cause in my opinion.

Regards,

Jerry Dengler

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Douglas Pauls
Sent: Thursday, May 10, 2012 12:18 PM
To: [log in to unmask]
Subject: [TN] IPC-5703 Question 1

Good morning all,

I am working on a draft of IPC-5703, titled " Cleanliness for
Fabricators", a kind of Cleanliness 101 for board fab houses.  It should
be ready for wider review in a month or so, but you can see drafts of it
here.

http://www.ipc.org/CommitteeDetail.aspx?Committee=5-32C

So you will see several questions from me. 

Question 1:  In the board fabrication process (not the OEM/EMS assembly
process), have any of you ever seen residue accumulation on in-circuit
test pins or flying probe test pins which interfere with in-circuit test
continuity?  Our board shop says it does not happen today.  It was a
more common occurrence 10 years ago when HASL was more prevalent, but I
don't believe it happens today.

Agree or not, and why.

Thanks.

Doug Pauls


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