The usuall suspects that influence reflow soldering can influence the
final dimension.
The dimension tolerances previously stated are what the PCB supplier delivers.
Size of PCB, thickness, material used to fab it, copper distribution,
thermal profile vs glass transition temperature all can change the
dimensions after reflow more than the 0.003 inches in 1st e-mail for
the profile. It could warp more than that and be in spec.

The smaller the PCB, the easier to hold it as many of the effects are
inch per inch.
So if you were fitting inside a hearing aid that fits inside an ear
there would be a better chance vs a rack mount telcom card.

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