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May 2012

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Subject:
From:
Martin Bayes <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Martin Bayes <[log in to unmask]>
Date:
Wed, 30 May 2012 03:11:28 -0500
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Hi Per-Erik

An example of a typical application for electrolytic Ni-P would be as an underlayer for electrolytic gold in connector pin applications. The better barrier properties of the Ni-P deposit can allow use of reduced gold thicknesses.

In that case, a solder connection would be made to the base of the connector pin.  However, solder joint volume and soldering conditions would be quite different to a PWB component attachment situation.

Regards
Martin

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