Joyce,

You are incorrect.  See Dave Hillman's TN posting on May 25, 2012 9:29am

Regards,
George
George M. Wenger
Senior Principal Reliability / FMA Engineer
Andrew Corporation - Wireless Network Solutions
40 Technology Drive, Warren, NJ 07059
(908) 546-4531 Office (732) 309-8964 Mobile
E-mail: [log in to unmask]

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Joyce Koo
Sent: Tuesday, May 29, 2012 1:14 PM
To: [log in to unmask]
Subject: Re: [TN] Phosphorus at the BGA pad

No. I think.  I'll wait for someone to correct me if I am wrong.  

Joyce Koo
Materials Researcher - Materials Interconnect Lab Research In Motion Limited
Office: (519) 888-7465 79945
Mobile: (226) 220-4760


-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Stephen Ayotte
Sent: Tuesday, May 29, 2012 12:55 PM
To: [log in to unmask]
Subject: [TN] Phosphorus at the BGA pad

There has been some discussion recently on the phosphorus level for ENiG.

My question is:

- for electrolytic nickel and gold deposition
- would you expect to find phosphorus at the soldered interface?

Thanks.


Stephen Ayotte
Manufacturing Quality Engineer
Bldg. 966 - 2,  Office 2J1309
Userid:  Stephen Ayotte/Burlington/IBM
Internet id: [log in to unmask]
Phone:  802 769 4775


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