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May 2012

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Subject:
From:
Vladimir Igoshev <[log in to unmask]>
Reply To:
Date:
Tue, 29 May 2012 17:23:36 +0000
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Electrolytic Ni simply doesn't have any P in it.
Regards,

Vladimir

SENTEC Testing Laboratory Inc.
11 Canadian Road, Unit 7.
Scarborough, ON M1R 5G1
Tel: (416) 899-1882
Fax: (905) 882-8812
www.sentec.ca

-----Original Message-----
From: Stephen Ayotte <[log in to unmask]>
Sender: TechNet <[log in to unmask]>
Date: Tue, 29 May 2012 12:54:56 
To: <[log in to unmask]>
Reply-To: TechNet E-Mail Forum <[log in to unmask]>,
        Stephen Ayotte
	<[log in to unmask]>
Subject: [TN] Phosphorus at the BGA pad

There has been some discussion recently on the phosphorus level for ENiG.

My question is:

- for electrolytic nickel and gold deposition
- would you expect to find phosphorus at the soldered interface?

Thanks.


Stephen Ayotte
Manufacturing Quality Engineer
Bldg. 966 - 2,  Office 2J1309
Userid:  Stephen Ayotte/Burlington/IBM 
Internet id: [log in to unmask]
Phone:  802 769 4775


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