No. I think.  I'll wait for someone to correct me if I am wrong.  

Joyce Koo
Materials Researcher - Materials Interconnect Lab
Research In Motion Limited
Office: (519) 888-7465 79945
Mobile: (226) 220-4760


-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Stephen Ayotte
Sent: Tuesday, May 29, 2012 12:55 PM
To: [log in to unmask]
Subject: [TN] Phosphorus at the BGA pad

There has been some discussion recently on the phosphorus level for ENiG.

My question is:

- for electrolytic nickel and gold deposition
- would you expect to find phosphorus at the soldered interface?

Thanks.


Stephen Ayotte
Manufacturing Quality Engineer
Bldg. 966 - 2,  Office 2J1309
Userid:  Stephen Ayotte/Burlington/IBM 
Internet id: [log in to unmask]
Phone:  802 769 4775


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