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May 2012

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Subject:
From:
Stephen Ayotte <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Stephen Ayotte <[log in to unmask]>
Date:
Tue, 29 May 2012 12:54:56 -0400
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There has been some discussion recently on the phosphorus level for ENiG.

My question is:

- for electrolytic nickel and gold deposition
- would you expect to find phosphorus at the soldered interface?

Thanks.


Stephen Ayotte
Manufacturing Quality Engineer
Bldg. 966 - 2,  Office 2J1309
Userid:  Stephen Ayotte/Burlington/IBM 
Internet id: [log in to unmask]
Phone:  802 769 4775


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