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May 2012

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TechNet E-Mail Forum <[log in to unmask]>, Craig Sullivan <[log in to unmask]>
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Wed, 16 May 2012 08:12:01 -0500
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"David D. Hillman" <[log in to unmask]>
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Hi Craig! One of the downsides of now having access to Xray inspection 
technology is that we can see many "things" we never could before - which 
now causes the question "is that bad?". There is currently no plated thru 
hole void criteria in the IPC JSTD 001 specification. I would recommend 
that an assessment of  the assembly be initiated. Pulling and inspecting a 
number of assemblies that either have been in the field or have passed all 
of the qualification tests will demonstrate what level of voids typically 
exist and if that level of voiding is a reliability issue. The presence of 
voids is not necessarily an indication of a reliability issue. Good Luck.

Dave Hillman
Rockwell Collins
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Subject
[TN] Through hole barrel voids






Hi everyone, 

 

We have a certain board with several through hole connectors. The customer
has provided us x ray images showing voiding in the barrels. Fillets on 
both
sides are acceptable, and the solderability tests are ok. This seems to be
isolated to this board because random sampling on other boards shows
virtually no voiding. The only voiding "criteria" I can find is related to
BGAs. Is there any published criteria / reference material for this type 
of
defect? 

 

Thank you,

Craig Sullivan

Manufacturing Engineer

MPL Incorporated

P: 607.266.0480

F: 607.266.0482

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