Victor,
Calculating the mating area between the lead and the solder just requires a
little math.  You know the length and width of the flat part of the lead
parallel to the board pad. That is part one.  Measure from the tangent of
the lead at the bottom of the heel to the highest point that the solder goes
up the lead, get the curvature from the spec sheet and you know the lead
width. You now have part two.  Add them together.

At Nortel we did lead pulls for years.  We just carefully cut the body of
the component off at the point where the leads went into the component body
proper, bent down every other lead (or two out of three - depends on lead
size and pitch) and then used a Dage device with a very small tweezer
gripper.  We got statistically the same results as another site using an
Instron tensile tester.

Bev

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Victor Hernandez
Sent: Tuesday, April 10, 2012 8:28 AM
To: [log in to unmask]
Subject: [TN] Dye & Pry, other than solder bumps

Fellow TechNetters:

   I am aware that D&P is typically done on BGA solder bump and the criteria
is the flat surface area.   If some wanted to apply this same
technique/method to a leaded component ie. Gull wing, J lead, etc.   How
could one calculate the mating area/surface.   They are totally different.
Besides that, it is difficult to pull the leads straight up.   Any
thought/comments will be greatly appreciated.

Victor,


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