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April 2012

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Subject:
From:
Blair Hogg <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Blair Hogg <[log in to unmask]>
Date:
Tue, 10 Apr 2012 11:48:20 -0500
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Can you epoxy a wire to the top of the device, then apply vertical force to pull it off the board? 

The maximum force may also be a useful indicator.

Blair

On Tue, 10 Apr 2012 07:27:45 -0500, Victor Hernandez <[log in to unmask]> wrote:

>Fellow TechNetters:
>
>   I am aware that D&P is typically done on BGA solder bump and the criteria is the flat surface area.   If some wanted to apply this same technique/method to a leaded component ie. Gull wing, J lead, etc.   How could one calculate the mating area/surface.   They are totally different.   Besides that, it is difficult to pull the leads straight up.   Any thought/comments will be greatly appreciated.
>
>Victor,
>
>
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