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April 2012

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From:
grandrien <[log in to unmask]>
Reply To:
grandrien <[log in to unmask]>
Date:
Wed, 4 Apr 2012 17:35:28 +0200
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How can you peformed 100,000 cycles ? Cycles means slow heating/cooling rate, lower than 20 C/min. So each cycle should be minimum 30min, more probably about 1h. So it would represent 5 to 11 years.
Where is my mistake ?

========================================
Message du 03/04/12 20:25
De : "Inge Hernefjord" 
A : [log in to unmask]
Copie à : 
Objet : Re: [TN] how to pass solder joint reliability of a 3.2 mm board (16 layers) for QFN packae

Can you develop your question so that a slow thinker like me can understand
TMCL 1000 c on QFN8's is very mild, I suppose nothing will happen. I
investigated QFN64's recently. They had passed 100,000 cycles with some few
issues. This was a -55/125 C test.
I think you should tell a little about the assembly, because that's what
decides the result.

Inge

On 2 April 2012 18:55, jonathan noquil wrote:

> Hi All
>
> Need some suggestions on how to handle solderjoint issue (How to tweak to
> pass TMCL1000 cycles- 0 to 100C) on QFN packages ( 5 x 6 x 1.0 mm with 8
> pins).
> Finish is Pure Sn
> Board is 16 layers 3.2 mm, HASL finish.
>
> Does someone had an experience to share?
>
> thanks
>
>
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