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April 2012

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Subject:
From:
Inge Hernefjord <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Inge Hernefjord <[log in to unmask]>
Date:
Tue, 3 Apr 2012 21:20:25 +0200
Content-Type:
text/plain
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text/plain (82 lines)
Y



On 3 April 2012 20:25, Post, Scott E <[log in to unmask]> wrote:

> 100,000 cycles of -55/+125C?  Did the parts have representative die in
> them?
>
> Scott Post
> P.O.U. 0000-001E-0CTC
> 2151 E. Lincoln Road
> Kokomo, Indiana    46904-9005
> 765-451-2983 (Phone)
> 765-451-0287 (FAX)
>
>
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of Inge Hernefjord
> Sent: Tuesday, April 03, 2012 2:24 PM
> To: [log in to unmask]
> Subject: Re: [TN] how to pass solder joint reliability of a 3.2 mm board
> (16 layers) for QFN packae
>
>  Can you develop your question so that a slow thinker like me can
> understand
> TMCL 1000 c on QFN8's is very mild, I suppose nothing will happen. I
> investigated QFN64's recently. They had passed 100,000 cycles with some few
> issues. This was a -55/125 C test.
> I think you should tell a little about the assembly, because that's what
> decides the result.
>
> Inge
>
> On 2 April 2012 18:55, jonathan noquil <[log in to unmask]> wrote:
>
> > Hi All
> >
> > Need some suggestions on how to handle solderjoint issue (How to tweak to
> > pass TMCL1000 cycles- 0 to 100C) on QFN packages ( 5 x 6 x 1.0 mm with 8
> > pins).
> > Finish is Pure Sn
> > Board is 16 layers 3.2 mm, HASL finish.
> >
> > Does someone had an experience to share?
> >
> > thanks
> >
> >
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