Hi Richard,
Yes we wash everything, DI water only, no chemistry. All of our paste,
fluxes, and core solder is water soluble.
I've looked at the boards post reflow but prior to cleaning and have not
noticed any mid-chip balls.
I will look a little closer just to make sure, to see if maybe we're washing
them away.
Steve
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Stadem, Richard D.
Sent: Monday, April 30, 2012 3:56 PM
To: [log in to unmask]
Subject: Re: [TN] Homeplates on 4 mil thick stencils?
Steve,
Somewhat related to the other discussion on cleaning of no-clean:
Do you wash the assemblies after reflow, and is that why you do not see any
mid-chip solder balls?
Do you wash any CCAs that have been processed with a no-clean solder paste
or no-clean wire solder?
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Steve Gregory
Sent: Monday, April 30, 2012 2:42 PM
To: [log in to unmask]
Subject: Re: [TN] Homeplates on 4 mil thick stencils?
BTW I forgot to add I don't homeplate anything...
Steve
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Steve Gregory
Sent: Monday, April 30, 2012 3:16 PM
To: [log in to unmask]
Subject: Re: [TN] Homeplates on 4 mil thick stencils?
Hi Ioan,
We use 4-mil thick stencils quite often and I don't see mid-chip balling...
Steve
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Ioan Tempea
Sent: Monday, April 30, 2012 2:54 PM
To: [log in to unmask]
Subject: [TN] Homeplates on 4 mil thick stencils?
Dear Technos,
It is my first 4 mil stencil and I was wondering if mid-chip balling is
still an issue at this thickness (no-clean process). Should I still
homeplate the apertures of passives, as I fear insufficient solder?
Thanks,
Ioan Tempea, ing.
Ingénieur Principal de Fabrication / Senior Manufacturing Engineer T |
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