Steve, 
Somewhat related to the other discussion on cleaning of no-clean:
Do you wash the assemblies after reflow, and is that why you do not see any mid-chip solder balls?
Do you wash any CCAs that have been processed with a no-clean solder paste or no-clean wire solder?

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Steve Gregory
Sent: Monday, April 30, 2012 2:42 PM
To: [log in to unmask]
Subject: Re: [TN] Homeplates on 4 mil thick stencils?

BTW I forgot to add I don't homeplate anything...

Steve

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Steve Gregory
Sent: Monday, April 30, 2012 3:16 PM
To: [log in to unmask]
Subject: Re: [TN] Homeplates on 4 mil thick stencils?

Hi Ioan,

We use 4-mil thick stencils quite often and I don't see mid-chip balling...

Steve

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Ioan Tempea
Sent: Monday, April 30, 2012 2:54 PM
To: [log in to unmask]
Subject: [TN] Homeplates on 4 mil thick stencils?

Dear Technos,

 

It is my first 4 mil stencil and I was wondering if mid-chip balling is still an issue at this thickness (no-clean process). Should I still homeplate the apertures of passives, as I fear insufficient solder?

 

Thanks,

 

Ioan Tempea, ing.
Ingénieur Principal de Fabrication / Senior Manufacturing Engineer T |
450.967.7100 ext.244 E | [log in to unmask] <mailto:[log in to unmask]> W | www.digico.cc <http://www.digico.cc/> 

 
 N'imprimer que si nécessaire - Print only if you must

 


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