Dear Technos,

 

It is my first 4 mil stencil and I was wondering if mid-chip balling is still an issue at this thickness (no-clean process). Should I still homeplate the apertures of passives, as I fear insufficient solder?

 

Thanks,

 

Ioan Tempea, ing.
Ingénieur Principal de Fabrication / Senior Manufacturing Engineer
T | 450.967.7100 ext.244
E | [log in to unmask] <mailto:[log in to unmask]>  
W | www.digico.cc <http://www.digico.cc/> 

 
 N'imprimer que si nécessaire - Print only if you must

 


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