There is a short shelf life ( I believe ...6 months ) on circuit frames.
They can be purchased individually as well.

On a nonfunction / mechanical BGA land repair, consider the BGA package
size and pin count. It is possible that there is no mechanical advantage of
replaceing that land; especially when there is a high pin count on a small
sized BGA.What would be the risk of not replacing land? I don't see the
"ball" solder migrating or moving without its attachment to PCB.

Of coarse, this condition would not meet the original requirements and may
require a waiver from the customer.
Eva



On Mon, Apr 30, 2012 at 8:09 AM, Goodyear, Patrick <[log in to unmask]> wrote:

> Circuit Medic carries the parts but they ain't cheap.   A master kit from
> Techni-tool will run around 785 or so.
>
> I just bought a bunch for the shop.
>
> Pat
>
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of Gumpert, Ben
> Sent: Monday, April 30, 2012 4:39 AM
> To: [log in to unmask]
> Subject: Re: [TN] EXTERNAL: [TN] BGA repair guidelines
>
> Mark,
>
> Check out IPC-7711/7721 4.7.3 "Surface Mount, BGA Pad Repair, Film
> Adhesive Method"
> I'm sure that there are repair kits available, but I don't know any
> specific sources.
>
> Ben
>
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of
> [log in to unmask]
> Sent: Friday, April 27, 2012 10:24 AM
> To: [log in to unmask]
> Subject: EXTERNAL: [TN] BGA repair guidelines
>
> Dear Forum;
>
> During BGA assembly rework attempt on a Class 2 assembly, one of the pads
> lifted.  This pad has no connection.  It is not used.
> I was looking for IPC guidance and found guidelines for PCB repair of
> traces, but so far found no reference for repair of a BGA pad.
>
> Are there guidelines for BGA repair and are there kits available to
> replace a lifted pad?
>
> What risk(s) would exist if the BGA were placed without that pad in place
> under the ball?.
>
> Regards,
>
> Mark Julstrom
>
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