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April 2012

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Subject:
From:
"Gumpert, Ben" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Gumpert, Ben
Date:
Mon, 30 Apr 2012 11:38:48 +0000
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Mark,

Check out IPC-7711/7721 4.7.3 "Surface Mount, BGA Pad Repair, Film Adhesive Method"
I'm sure that there are repair kits available, but I don't know any specific sources.

Ben

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of [log in to unmask]
Sent: Friday, April 27, 2012 10:24 AM
To: [log in to unmask]
Subject: EXTERNAL: [TN] BGA repair guidelines

Dear Forum;
 
During BGA assembly rework attempt on a Class 2 assembly, one of the pads lifted.  This pad has no connection.  It is not used.
I was looking for IPC guidance and found guidelines for PCB repair of traces, but so far found no reference for repair of a BGA pad.
 
Are there guidelines for BGA repair and are there kits available to replace a lifted pad?
 
What risk(s) would exist if the BGA were placed without that pad in place under the ball?.
 
Regards,
 
Mark Julstrom

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