Inge,

Were the QFN8's built with no-clean SAC 305 on Ag or SAC 305 HASL?

Also was there a center pad?

Paul

Paul Edwards
Process/Quality Engineering
Surface Art Engineering

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Inge Hernefjord
Sent: Tuesday, April 03, 2012 11:24 AM
To: [log in to unmask]
Subject: Re: [TN] how to pass solder joint reliability of a 3.2 mm board (16 layers) for QFN packae

Can you develop your question so that a slow thinker like me can understand
TMCL 1000 c on QFN8's is very mild, I suppose nothing will happen. I
investigated QFN64's recently. They had passed 100,000 cycles with some few
issues. This was a -55/125 C test.
I think you should tell a little about the assembly, because that's what
decides the result.

Inge

On 2 April 2012 18:55, jonathan noquil <[log in to unmask]> wrote:

> Hi All
>
> Need some suggestions on how to handle solderjoint issue (How to tweak to
> pass TMCL1000 cycles- 0 to 100C) on QFN packages ( 5 x 6 x 1.0 mm with 8
> pins).
> Finish is Pure Sn
> Board is 16 layers 3.2 mm, HASL finish.
>
> Does someone had an experience to share?
>
> thanks
>
>
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