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April 2012

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Fri, 27 Apr 2012 07:23:59 -0700
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Dear Forum;
 
During BGA assembly rework attempt on a Class 2 assembly, one of the pads lifted.  This pad has no connection.  It is not used.
I was looking for IPC guidance and found guidelines for PCB repair of traces, but so far found no reference for repair of a BGA pad.
 
Are there guidelines for BGA repair and are there kits available to replace a lifted pad?
 
What risk(s) would exist if the BGA were placed without that pad in place under the ball?.
 
Regards,
 
Mark Julstrom

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