Hi Scott - in your testing trials, have the QFNs had center pads (aka 
thermal/grounding pads) which were soldered down to the assembly?

Dave



"Post, Scott E" <[log in to unmask]> 
Sent by: TechNet <[log in to unmask]>
04/03/2012 01:25 PM
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Re: [TN] how to pass solder joint reliability of a 3.2 mm board (16 
layers) for QFN packae






100,000 cycles of -55/+125C?  Did the parts have representative die in 
them?

Scott Post
P.O.U. 0000-001E-0CTC
2151 E. Lincoln Road
Kokomo, Indiana    46904-9005
765-451-2983 (Phone)
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-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Inge Hernefjord
Sent: Tuesday, April 03, 2012 2:24 PM
To: [log in to unmask]
Subject: Re: [TN] how to pass solder joint reliability of a 3.2 mm board 
(16 layers) for QFN packae

Can you develop your question so that a slow thinker like me can 
understand
TMCL 1000 c on QFN8's is very mild, I suppose nothing will happen. I
investigated QFN64's recently. They had passed 100,000 cycles with some 
few
issues. This was a -55/125 C test.
I think you should tell a little about the assembly, because that's what
decides the result.

Inge

On 2 April 2012 18:55, jonathan noquil <[log in to unmask]> wrote:

> Hi All
>
> Need some suggestions on how to handle solderjoint issue (How to tweak 
to
> pass TMCL1000 cycles- 0 to 100C) on QFN packages ( 5 x 6 x 1.0 mm with 8
> pins).
> Finish is Pure Sn
> Board is 16 layers 3.2 mm, HASL finish.
>
> Does someone had an experience to share?
>
> thanks
>
>
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