TECHNET Archives

April 2012

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
Robert Kondner <[log in to unmask]>
Reply To:
Date:
Thu, 26 Apr 2012 16:36:25 -0400
Content-Type:
text/plain
Parts/Attachments:
text/plain (87 lines)
Well,

1  You heat flux to ACTIVATE flux. (Activate as in make chemically active
for oxide film removal.) 

2 Not heating a No Clean flux does not leave activated chemicals. If so No
Clean wire solder would be useless as hand soldering does not chemically
react all the flux in the solder. RMA wire solder is a good example.

 If anyone can site a manufacturers data sheet or any No Clean flux product
that requires cleaning after use that would be serious input to this
discussion. 

Bob K.




	

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Stadem, Richard D.
Sent: Thursday, April 26, 2012 4:23 PM
To: [log in to unmask]
Subject: Re: [TN] Cleaning non-clean paste

May I amend that a little bit?
Here is what I would say:
Ideal scenario would be to either use a flux meant to be cleaned, then
clean, or to not clean a no-clean flux, PROVIDED IT HAS BEEN SUBJECTED TO
HEAT TO INERT (DE-ACTIVATE) IT.

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of R Sedlak
Sent: Thursday, April 26, 2012 3:09 PM
To: [log in to unmask]
Subject: Re: [TN] Cleaning non-clean paste

Fabien:  All replies so far have been excellent.  I want to underline that a
no-clean flux, being formulated to not require cleaning, will by its nature
be much more difficult to clean than a flux meant to be cleaned, so it is
highly probable you are leaving at least some flux residue on the board. 
Ideal scenario would be to either use a flux meant to be cleaned, then
clean, or to not clean a no-clean flux.

Rudy Sedlak
RD Chemical Company

--- On Thu, 4/26/12, Fabien Guizelin <[log in to unmask]> wrote:

From: Fabien Guizelin <[log in to unmask]>
Subject: [TN] Cleaning non-clean paste
To: [log in to unmask]
Date: Thursday, April 26, 2012, 6:40 AM

Hi,
Can you summarize the risks linked to cleaning a non-clean paste ?
I am concerned by incomplete cleaning of the non-clean leaving active
residue on the board.
We are using Inudium 5.1 (non-clean, Pb free), cleaned with Vigon A250.
We are using non-clean because of experience of that paste (internally and
at EMS shop) and we are cleaning to promote underfill bonding.
Thanks,
Fabien


______________________________________________________________________
This email has been scanned by the Symantec Email Security.cloud service.
For more information please contact helpdesk at x2960 or [log in to unmask]
______________________________________________________________________

______________________________________________________________________
This email has been scanned by the Symantec Email Security.cloud service.
For more information please contact helpdesk at x2960 or [log in to unmask]
______________________________________________________________________

______________________________________________________________________
This email has been scanned by the Symantec Email Security.cloud service.
For more information please contact helpdesk at x2960 or [log in to unmask]
______________________________________________________________________


______________________________________________________________________
This email has been scanned by the Symantec Email Security.cloud service.
For more information please contact helpdesk at x2960 or [log in to unmask] 
______________________________________________________________________

ATOM RSS1 RSS2