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April 2012

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Subject:
From:
Mike Fenner <[log in to unmask]>
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Date:
Thu, 26 Apr 2012 17:28:58 +0100
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Strictly no clean describes a process not just a flux, so the whole process
has to be no clean. (Handling processing  etc).
No clean when applied to fluxes doesn't mean can't clean or don't clean. It
just means the material has not been optimized for cleaning but for residues
which are considered safe without cleaning (according to some established
standard). So the types of risk of cleaning a no clean will be generally
similar to comparable to similar efficiency fluxes whether called no clean
or not. 
Within that "risk envelope", due to the different formulation approaches
possible in making a no clean product [and similarly for cleaners and
processes], the relative risks of one type of hazard from incomplete
cleaning compared to another will vary according to your specific
flux/cleaner combination and use circumstances.


Regards

Mike Fenner 
Bonding Services & Products
T: +44 [0] 1865 522 663 E: [log in to unmask]

 


-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Fabien Guizelin
Sent: Thursday, April 26, 2012 2:41 PM
To: [log in to unmask]
Subject: [TN] Cleaning non-clean paste

Hi,
Can you summarize the risks linked to cleaning a non-clean paste ?
I am concerned by incomplete cleaning of the non-clean leaving active
residue on the board.
We are using Inudium 5.1 (non-clean, Pb free), cleaned with Vigon A250.
We are using non-clean because of experience of that paste (internally and
at EMS shop) and we are cleaning to promote underfill bonding.
Thanks,
Fabien


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