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April 2012

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Subject:
From:
Steve Gregory <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Steve Gregory <[log in to unmask]>
Date:
Mon, 30 Apr 2012 15:15:49 -0400
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Hi Ioan,

We use 4-mil thick stencils quite often and I don't see mid-chip balling...

Steve

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Ioan Tempea
Sent: Monday, April 30, 2012 2:54 PM
To: [log in to unmask]
Subject: [TN] Homeplates on 4 mil thick stencils?

Dear Technos,

 

It is my first 4 mil stencil and I was wondering if mid-chip balling is
still an issue at this thickness (no-clean process). Should I still
homeplate the apertures of passives, as I fear insufficient solder?

 

Thanks,

 

Ioan Tempea, ing.
Ingénieur Principal de Fabrication / Senior Manufacturing Engineer T |
450.967.7100 ext.244 E | [log in to unmask] <mailto:[log in to unmask]> W |
www.digico.cc <http://www.digico.cc/> 

 
 N'imprimer que si nécessaire - Print only if you must

 


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