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Sender:	TechNet <[log in to unmask]>
X-To:	TechNet E-Mail Forum <[log in to unmask]>, R Sedlak <[log in to unmask]>
Date:	Thu, 26 Apr 2012 15:22:54 -0500
Reply-To:	TechNet E-Mail Forum <[log in to unmask]>, "Stadem, Richard D." <[log in to unmask]>
Message-ID:	<[log in to unmask]>
Subject:	Re: Cleaning non-clean paste
From:	"Stadem, Richard D." <[log in to unmask]>
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In-Reply-To:	<[log in to unmask]>
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May I amend that a little bit?
Here is what I would say:
Ideal scenario would be to either use a flux meant to be cleaned, then clean, or to not clean a no-clean flux, PROVIDED IT HAS BEEN SUBJECTED TO HEAT TO INERT (DE-ACTIVATE) IT.

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of R Sedlak
Sent: Thursday, April 26, 2012 3:09 PM
To: [log in to unmask]
Subject: Re: [TN] Cleaning non-clean paste

Fabien:  All replies so far have been excellent.  I want to underline that a no-clean flux, being formulated to not require cleaning, will by its nature be much more difficult to clean than a flux meant to be cleaned, so it is highly probable you are leaving at least some flux residue on the board.  Ideal scenario would be to either use a flux meant to be cleaned, then clean, or to not clean a no-clean flux.

Rudy Sedlak
RD Chemical Company

--- On Thu, 4/26/12, Fabien Guizelin <[log in to unmask]> wrote:

From: Fabien Guizelin <[log in to unmask]>
Subject: [TN] Cleaning non-clean paste
To: [log in to unmask]
Date: Thursday, April 26, 2012, 6:40 AM

Hi,
Can you summarize the risks linked to cleaning a non-clean paste ?
I am concerned by incomplete cleaning of the non-clean leaving active residue on the board.
We are using Inudium 5.1 (non-clean, Pb free), cleaned with Vigon A250.
We are using non-clean because of experience of that paste (internally and at EMS shop) and we are cleaning to promote underfill bonding.
Thanks,
Fabien

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