All of the following presentations were recorded at IPC APEX EXPO 2012. They are available at no charge to IPC members (download only) and for $50 each standard industry rates. To access these presentations or to learn more about them, click through the individual links below. APEXPO12-S02-1 Whiskers and Alternative Surface Finishes at Press-in Technology<https://portal.ipc.org/Purchase/ProductDetail.aspx?Product_code=7ee144e5-2983-e111-bd6c-00155d05286a> APEXPO12-S02-2 An Investigation of Whisker Growth on Tin Coated Wire and Braid<https://portal.ipc.org/Purchase/ProductDetail.aspx?Product_code=ab13f925-0780-e111-bd6c-00155d05286a> APEXPO12-S02-3 Effects of Tin and Copper Nanotexturization on Tin Whisker Formation<https://portal.ipc.org/Purchase/ProductDetail.aspx?Product_code=44f1b09a-0980-e111-bd6c-00155d05286a> APEXPO12-S07-1 PCB Trace Impedance: Impact of Localized Copper Density<https://portal.ipc.org/Purchase/ProductDetail.aspx?Product_code=bac2abec-5382-e111-bd6c-00155d05286a> APEXPO12-S07-2 A Study of PCB Insertion Loss Variation Using a New Low Cost Metrology<https://portal.ipc.org/Purchase/ProductDetail.aspx?Product_code=ed24f42f-5f82-e111-bd6c-00155d05286a> APEXPO12-S11-1 Morphology Evolution and Voiding of Solder Joints on QFN Central Pads With a Ni/AU Finish<https://portal.ipc.org/Purchase/ProductDetail.aspx?Product_code=c86e42ce-2883-e111-bd6c-00155d05286a> APEXPO12-S16-3 An Investigation Into Low Temperature Tin-Bismuth and Tin-Bismuth-Silver Lead-free Alloy Solder Pastes for Electronics Manufacturing Applications<https://portal.ipc.org/Purchase/ProductDetail.aspx?Product_code=9b8d7908-0380-e111-bd6c-00155d05286a> APEXPO12-S21-2 Drop Test Performance of BGA Assembly Using SAC105Ti Solder Sphere<https://portal.ipc.org/Purchase/ProductDetail.aspx?Product_code=31d14221-0c80-e111-bd6c-00155d05286a> APEXPO12-S26-1 Halogen-free Lead-free Solder Paste with Advanced Activator Technology<https://portal.ipc.org/Purchase/ProductDetail.aspx?Product_code=0e2fd169-1383-e111-bd6c-00155d05286a> APEXPO12-S26-2 The Effect of Powder Surface Area and Oxidation on the Voiding Performance of PoP Solder Pastes<https://portal.ipc.org/Purchase/ProductDetail.aspx?Product_code=294555b2-1783-e111-bd6c-00155d05286a> APEXPO12-S32-2 Assembly and Reliability of 1704 I/O FCBGA & FPBGAs<https://portal.ipc.org/Purchase/ProductDetail.aspx?Product_code=d8711f92-3583-e111-bd6c-00155d05286a> APEXPO12-S32-3 The Relationship between Backward Compatibil Assembly and Microstructure on the Thermal Reliability of an Extremely Large Ball Grid Array<https://portal.ipc.org/Purchase/ProductDetail.aspx?Product_code=580d45c0-3483-e111-bd6c-00155d05286a> Kimberly Sterling, CAE Vice President, Marketing and Communications IPC - Association Connecting Electronics Industries 3000 Lakeside Drive Suite 309 S Bannockburn, IL 60015-1249 USA +1 847-597-2805 tel +1 847-615-5605 fax [log in to unmask]<mailto:[log in to unmask]> www.ipc.org<http://www.ipc.org> -------------------------------------------------------------------------------- IPC_New_Releases Mail List provided as a free service by IPC using LISTSERV 16.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF IPC_New_Releases Search previous postings at: http://listserv.ipc.org/archives/index.html Please visit IPC web site (www.ipc.org > Knowledge > Email Forums) for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 --------------------------------------------------------------------------------
