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| Date: | Thu, 1 Mar 2012 09:45:08 +0000 |
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dear technet users,
the maximum twist during PCB assembly is often specified with 1000µm/m (>1000 µe microstrain), as ceramic capacitors crack above 2500 µe. is this value of 1000µe specified by IPC, IEC or someone else?
thanks and best regards,
torsten
i.A. Dipl.Ing.(FH)Torsten Hagge
team leader HW development &
tech. projectmanager
Kristronics GmbH
Gewerbegrund 5 - 9
24955 Harrislee
Tel.: +49 461 7741 624
Fax: +49 461 7741 642
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www.kristronics.de
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