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March 2012

TechNet@IPC.ORG

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Subject:
From:
EIMCNews <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, EIMCNews <[log in to unmask]>
Date:
Thu, 1 Mar 2012 08:05:47 -0800
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Some are able to plate with better tolerances.  It depends on how the
plating cell is set up for that particular board. What does your board
supplier say?  Admittedly, getting 5 mils anywhere on the surface to achieve
a 1 mil minimum deposit "somewhere" is wasteful of materials, is time
consuming and can compromise the planarity of the surface for subsequent
processes.

You didn't say what problem this overplating is causing.


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