One cannot "grind" soldered component leads, due to ESD issues. Do you mean cut, such as with a Q-cutter or equivalent tool?
Prior to soldering, leads can be trimmed very precisely, depending on the variation in the seating of the component.

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Jack Olson
Sent: Monday, March 26, 2012 9:13 AM
To: [log in to unmask]
Subject: Re: [TN] ASSY: Short leads in a PWA

16 YEARS at TechNet?
I still feel like "the new guy"!!!

onward thru the fog,
Jack


On Wed, 27 Mar 1996 07:16:59 -0800, Jack Olson <[log in to unmask]> wrote:

>[log in to unmask] wrote:
>>      Due to a "non-existent" clearance between a PWA and a shielded case,
>>      we would like to have certain components with lead lengths that are
>>      not long enough to protrude through to the secondary side of the
>>      board.  Thus, there would be no fillet for a solder joint.
>
>We had a similar situation, but in our case we specified that the leads be
>clipped (after soldering), and the fillet ground down to .030 mils. These
>boards were for airplanes and had to undergo shock, vibration, environmental
>testing etc. NO PROBLEMS. Of course, you said your clearance was
>"non-existent", can you spare 30 mils? And by "shielded case" do you mean
>conductive? You might have to apply some adhesive KAPTON over the pads after
>you grind them, but at least by grinding you have the most lead length, and
>strongest solderjoint possible, still much stronger than a SMT connection,
>right?
>					           Jack
>p.s. I would like to hear what others recommend, though... anybody else?
>
>

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