It is a base dielectric material.  The plating portion of the wet process begins with an electroless Cu bath.       



----- Forwarded Message -----
From: Ian Hanna <[log in to unmask]>
To: "[log in to unmask]" <[log in to unmask]> 
Sent: Friday, March 23, 2012 12:47 PM
Subject: Re: [TN] plating void

do you mean base dielectric material, or base copper material -- an electrolytic  copper plating void will still leave the base copper intact  if it is caused by a bubble -- what is the shape of the edges, is it tapered or rounded -- is the void in the centre of the hole or towards the outside? any photos? could be electroless copper void electrolytic copper void tin void dry-film residue 
From:  "[log in to unmask]" <[log in to unmask]>  
To:  <[log in to unmask]>  
Date:  23/03/2012 03:41 PM  
Subject:  [TN] plating void  
Sent by:  TechNet <[log in to unmask]> 

________________________________
I'm looking for input on the following plating defect.
 
I observe a plating void that occurs on a Cu plated feature with ENIG finish.    The void goes down to the base material.  The defect is typically .002 diameter.  The feature size is .010 across.  The parts run on a manual plating line and hang on a small plating rack.   
 
The plating engineer believes the root cause of the void is a bubble on the part during plating.  The action plan includes implementing stronger vibration on the part in the plating bath.  
 
I have two questions.  
1.  How much vibration is typically needed to avoid developing a bubble on a part during plating?
2.  For this plating void defect, is it possible that Ni corrosion or other reliability concerns would eventually develop if defective parts escaped?   
 
Thank you,
 
Mark Julstrom

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