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March 2012

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Subject:
From:
Guy Ramsey <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Guy Ramsey <[log in to unmask]>
Date:
Thu, 22 Mar 2012 12:38:43 -0400
Content-Type:
text/plain
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text/plain (127 lines)
One a possible cause. 

There are a couple of questions in my mind:
Has the mask performed its role in achieving form fit and function?
 
Is the anomaly and indication that some other condition may exist? In other
words, was the board subject to conditions that might have caused some less
visible condition that reduces the product life in its service environment. 

Committee consensus: A1, A2, D3.

Your mileage may vary, Guy.



-----Original Message-----
From: [log in to unmask] [mailto:[log in to unmask]] 
Sent: Thursday, March 22, 2012 12:08 PM
To: [log in to unmask]; [log in to unmask]
Cc: [log in to unmask]
Subject: RE: [TN] EXTERNAL: [TN] Acceptability of Cracked Solder Mask

Moisture ingression point to the laminate.

Victor,

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Guy Ramsey
Sent: Thursday, March 22, 2012 11:04 AM
To: [log in to unmask]
Subject: Re: [TN] EXTERNAL: [TN] Acceptability of Cracked Solder Mask

You looking at pate 10-46 in revE? 
Cracking of Solder mask:  A1, A2, D3.

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Gumpert, Ben
Sent: Wednesday, March 21, 2012 3:39 PM
To: [log in to unmask]
Subject: Re: [TN] EXTERNAL: [TN] Acceptability of Cracked Solder Mask

Bill,

Looking again at your images, you could say that the cracks don't actually
bridge non-common circuits since you have non-solder mask defined pads - the
crack ends before it reaches another circuit.

Ben

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Gumpert, Ben
Sent: Wednesday, March 21, 2012 3:30 PM
To: [log in to unmask]
Subject: Re: [TN] EXTERNAL: [TN] Acceptability of Cracked Solder Mask

Bill,

I see the confusion; 610 mentions a target condition for cracks, but then
doesn't follow up with an acceptable or defect condition for cracks. 

But later in the document, a solder mask scratch that bridges non-common
circuits is indicated as a defect for all classes, so I would have to say a
crack bridging non-common circuits is also a defect for all classes.

Ben

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of William Clark
Sent: Wednesday, March 21, 2012 3:03 PM
To: [log in to unmask]
Subject: EXTERNAL: [TN] Acceptability of Cracked Solder Mask

It is not clear to me from IPC 610-E if a crack in a solder mask constitutes
a Class 1 or Class 2 defect.  Pictures of the typical cracks we are seeing
are at the link below.  The crack in picture 3 repeats at the same feature
on every board in the array.  The cracks were not visible on the bare board
and the boards passed the tape test.  I'm looking for input on the
suitability of these boards.

Thanks

Bill

http://s1066.photobucket.com/albums/u408/clarkerg/

 

Bill Clark

Manufacturing Engineering and Quality Manager

ERG, <http://www.ergpower.com/>   Inc.  2601 Wayne Street, Endicott, NY
13760

607-754-9187

 



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