It is not clear to me from IPC 610-E if a crack in a solder mask constitutes
a Class 1 or Class 2 defect.  Pictures of the typical cracks we are seeing
are at the link below.  The crack in picture 3 repeats at the same feature
on every board in the array.  The cracks were not visible on the bare board
and the boards passed the tape test.  I'm looking for input on the
suitability of these boards.

Thanks

Bill

http://s1066.photobucket.com/albums/u408/clarkerg/

 

Bill Clark

Manufacturing Engineering and Quality Manager

ERG, <http://www.ergpower.com/>   Inc.  2601 Wayne Street, Endicott, NY
13760

607-754-9187

 



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