Amol,
When it comes to "positioning accuracy" (actually "precision") as measured
by an inspection machine, besides stencil-to-board alignment, other factors
are stencil aperture location precision and board pad location precision.
I have a lot of information on the first one, but none on the second one.
Ahne.
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Carl Ray
Sent: 21 March, 2012 5:32 AM
To: [log in to unmask]
Subject: Re: [TN] Evaluating solderpaste inspection machines
Amol,
One of the biggest issues we encountered over the years doing SPI
Evaluations is the positioning accuracy of the printer up line. Not sure
which equipment you are evaluating but with the equipment we have the
measurements were referenced off the surface area of the PWB. When we ran
the tests we seen significant impact of the repeatability of the printer
which affected the gasketing on the test vehicle which affected our volume
and area measurements. So you might want to take this into count when you
chose your test vehicle. If your using a stencil that is cut one to one and
the printer exhibits drift then your gasketing will be affected causing
variation in your readings of area and volume. This would reflect more on
the printer than the SPI but a good SPI you will see this and make
conclusions as to the effect on your process.
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Robert Kondner
Sent: Wednesday, March 21, 2012 8:13 AM
To: [log in to unmask]
Subject: Re: [TN] Evaluating solderpaste inspection machines
Amol,
One possible small paste target deposit is the small round solder deposits
used to define "Solder Bump" test point. I think they were 10 mil rounds.
Not sure.
Just an idea.
Bob K.
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Amol Kane
(Asteelflash,US)
Sent: Wednesday, March 21, 2012 8:08 AM
To: [log in to unmask]
Subject: [TN] Evaluating solderpaste inspection machines
Dear All,
I am in the process of coming up with a testing plan for evaluating
solderpaste inspection (SPI) equipment and have some questions. One of the
first things I want to perform is a GR&R study on a NIST certified target of
the smallest possible size. I can understand the repeatability part, but is
reproducibility a valid measurement criterion as the only operator
involvement in this case will be assembly loading/unloading and all other
external conditions will remain the same?
I also plan to evaluate the effect of board rotation (0 vs 90 degrees) on
volume measurements by a simple DOE using ANOVA, investigate process control
using control charts and calculate Cpk for the calibration target and actual
volume measurements on the most technologically complex assembly we build
(0201s, QFNs, fine pitch BGAs etc.,). Don't have anything with a 01005 as of
yet. Is there anything else that I have not included (but is a critical
data driven factor for evaluation)?
Also, If anybody else has performed SPI evaluation in the past and is
willing to share their evaluation plan, I can combine it what I have and
publish it on technet for future use with due credits.
Thanks,
Amol
______________________________________________________________________
This email has been scanned by the Symantec Email Security.cloud service.
For more information please contact helpdesk at x2960 or [log in to unmask]
______________________________________________________________________
______________________________________________________________________
This email has been scanned by the Symantec Email Security.cloud service.
For more information please contact helpdesk at x2960 or [log in to unmask]
______________________________________________________________________
______________________________________________________________________
This email has been scanned by the Symantec Email Security.cloud service.
For more information please visit http://www.symanteccloud.com
______________________________________________________________________
______________________________________________________________________
This email has been scanned by the Symantec Email Security.cloud service.
For more information please contact helpdesk at x2960 or [log in to unmask]
______________________________________________________________________
______________________________________________________________________
This email has been scanned by the Symantec Email Security.cloud service.
For more information please contact helpdesk at x2960 or [log in to unmask]
______________________________________________________________________
|
