Amol,

 One possible small paste target deposit is the small round solder deposits
used to define "Solder Bump" test point. I think they were 10 mil rounds.
Not sure.

 Just an idea.

Bob K.

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Amol Kane
(Asteelflash,US)
Sent: Wednesday, March 21, 2012 8:08 AM
To: [log in to unmask]
Subject: [TN] Evaluating solderpaste inspection machines

Dear All,

I am in the process of coming up with a testing plan for evaluating
solderpaste inspection (SPI) equipment and have some questions. One of the
first things I want to perform is a GR&R study on a NIST certified target of
the smallest possible size. I can understand the repeatability part, but is
reproducibility a valid measurement criterion as the only operator
involvement in this case will be assembly loading/unloading and all other
external conditions will remain the same?

 

I also plan to evaluate the effect of board rotation (0 vs 90 degrees) on
volume measurements by a simple DOE using ANOVA, investigate process control
using control charts and calculate Cpk for the calibration target and actual
volume measurements on the most technologically complex assembly we build
(0201s, QFNs, fine pitch BGAs etc.,). Don't have anything with a 01005 as of
yet.  Is there anything else that I have not included (but is a critical
data driven factor for evaluation)?
Also, If anybody else has performed SPI evaluation in the past and is
willing to share their evaluation plan, I can combine it what I have and
publish it on technet for future use with due credits.

 

Thanks,

Amol

 


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