Drill edge to drill edge is important for managing CAF potential and 
(esp in seq lam stackups) for delam potential due to breaking down 
glass fabric. e.g. If adjacent drills are close enough to intersect 
the same knuckle in the glass interesting things can happen.  Don't 
ask me how I know (I keep that t-shirt buried deep in the closet with 
the skeletons). ;-)

  At 01:53 PM 3/20/2012, Larry Dzaugis wrote:
>The PCB Fab has minimum pad sizes for PTH due to drilling and plating
>requirements.
>Check with the PCB Fab that will make this for their requirements.
>
>
>______________________________________________________________________
>This email has been scanned by the Symantec Email Security.cloud service.
>For more information please contact helpdesk at x2960 or [log in to unmask]
>______________________________________________________________________


______________________________________________________________________
This email has been scanned by the Symantec Email Security.cloud service.
For more information please contact helpdesk at x2960 or [log in to unmask] 
______________________________________________________________________