Technetters,

I'm wondering is there a rule of thumb  for pass/fail acceptance on champagne voids (like one for delta Tg or Au embrittlement)?

We see a fair amount of micro (few microns level) voids on a customer board and they are wondering how they can "push" their IAg board supplier.

X-ray rule isn't going to work as they can not be reliably resolve due to the size.

Thank you very much in advance for constructive responses :-).
Vladimir

SENTEC Testing Laboratory Inc.
11 Canadian Road, Unit 7.
Scarborough, ON M1R 5G1
Tel: (416) 899-1882
Fax: (905) 882-8812
www.sentec.ca

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