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March 2012

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From:
"Lehmicke, Michael" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Lehmicke, Michael
Date:
Fri, 16 Mar 2012 08:50:04 -0500
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James is correct, good point. One way we have gotten around the  Flex Polyimide issue when scoring; if the stack-up will allow it, you can put the Polyimide layers just slightly off-center so the scoring process will completely cut through them and leave only the hardboard laminate.

Mike Lehmicke

-----Original Message-----
From: James Mahoney [mailto:[log in to unmask]]
Sent: Friday, March 16, 2012 8:44 AM
To: TechNet E-Mail Forum; Lehmicke, Michael
Subject: RE: Panelization of Rigid-Flex assemblies

The only other thing I would consider is when scoring the High Speed laminates the polyimide gets relatively thick and scoring can be a pain to break apart. Seems like any 2mil maybe 3mils or less works pretty good with the scoring method and using the cutting wheel at assembly to break apart. This should also be evaluated when using the old fashion web/micro drill the thicker polyimide can be a pain to break apart.



Thank you, Jim Mahoney
Mass Design Inc.
Applications Engineer
P# 603-886-6460 X215
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-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Lehmicke, Michael
Sent: Friday, March 16, 2012 9:08 AM
To: [log in to unmask]
Subject: Re: [TN] Panelization of Rigid-Flex assemblies

Amol,

When we panelize rigid Flex, depending on the shape, we use either a partial route and "cracker cut' or we add rails that are scored, which can then be snapped off after assembly.

Mike Lehmicke
Molex Copper Flex products
22 Empire Drive
St. Paul, MN 55103
651-846-7728
[log in to unmask]



-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Amol Kane (Asteelflash,US)
Sent: Thursday, March 15, 2012 8:16 AM
To: [log in to unmask]
Subject: [TN] Panelization of Rigid-Flex assemblies

Dear Technetters,

We will be building some rigid flex boards on SMT that are about 2x2".
They will need to be panelized to run. We had previously run such
assemblies in a multiple up SMT pallets, but I am curious to know if
there are methods/best practices for panelizing the flex part of the
circuit from a depanelizing perspective.  i.e can they be panelized and
then separated and if yes, how?



Thanks,

Amol




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